RB-MEMS Consultant inc.

MEMS Design & Solutions to bring new device to microfabrication and to volume manufacturing.

Photonic Integrated Circuit (PIC) Design and microfabrication towards volume manufacturing

Our team has vast experience in semiconductor industry, volume manufacturing and process development as well as multi-physics modeling and MEMS & photonics design.




Services:
  • MEMS device design and modeling.
  • Photonic integrated circuit (PIC) design and modeling.
  • Specialized microfabrication process flow design with high volume manufacturing mindset.
  • Microfabrication Prototyping with partners.
  • Design respecting process design kit (PDK) for multi-project wafer runs (MPW).
  • Risk analysis and Risk mitigation plan.
  • Assist your Fabless business model to bring your device into high volume manufacturing.

  • You pay us, so you own the intellectual property that we develop for you.


Highlights:

  • TOP NEWS!: We received a distinction as Top Solution Provider from Semiconductor Review.
    "Our team consists of experienced professionals with experience in MEMS, photonics design, wafer processing, and prototype, and they are capable of deveoping products that are high-volume foundry-compatible."

  • Developing complex multi-substrate MEMS/MOEMS processes (involving up to 6 wafer-level bondings).
  • MEMS design and electro-mechanical simulations.
  • Photonics simulations and PIC design.
  • Deeply involved in many MEMS and photonics projects, some involving in depth material science, some micro-mirrors, IR-imagers, some involving acoustics, inertial sensors, fluidic device, pressure sensors, etc. This includes many aspects such as process step development, material properties development, process tool modifications, handling tools modification development, and very low defect level optimization.
  • Experience in photonics design.
  • Experience in Wafer Level Packaging and knowledge in Fan-Out.
  • Extensive knowledge in DRIE, plasma etching, photolithography, wet etch, TMAH,  striping, PECVD, Sputter deposition, wafer-level bonding, VHF, etc.
  • Experience in challenging etching development: Filled Through Silicon Via, TSV reveal, 2-level DRIE, dry etching of exotic materials, complex DRIE shapes, tight critical dimensions for inertial devices, etc.

Please contact: richard.beaudry@rb-memsconsultant.com